Supermicro Extreme Density 6U MicroBlade Solutions Deliver Much Higher Density and Energy Efficiency by Enabling VLP DDR4 16/32GB RDIMM

SAN JOSE, Calif., May 4, 2015 /PRNewswire/ — Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing, is shipping the new extreme-density server platform in high volume, targeting hyper-scale data center, cloud, web hosting environments and video streaming, VDI, high performance video/graphics applications. MicroBlade is a revolutionary, converged architecture that helps data centers around the world save money, space, and time. Unlike other architecture that requires costly investment in proprietary rack and facility infrastructure, Supermicro MicroBlade is a truly open and flexible architecture that fits in the industry standard 19″ rack form factor at the best possible costs. It is a 6U, standard 19″ rack-based, converged computing platform that combines the density, ease of use, manageability, high availability, serviceability, efficiency of blade servers with the cost advantage of rack-mount servers. Supermicro has increased node density and maximized energy efficiency and cooling by enabling VLP DDR4 16/32GB RDIMM. Enabling this technology with Industry leading memory vendors, Supermicro is able to offer this technology at regular DIMM cost.

The modular MicroBlade architecture, supporting Intel® Xeon® E5-2600 v3, E3-1200 v3, Xeon® D-1500, and Atom™ C2000 series processors, maximizes rack space with full-featured power-conserving servers in easily serviceable front access hot-swap blade modules. Compute and storage are integrated in these 28 blades and shared networking, power and cooling are located at the rear of the system. The 6U MicroBlade enclosure incorporates redundant Titanium-Level high-efficiency (96%+) Digital Switching power supplies, optimized airflow with redundant energy-efficient cooling fans, redundant chassis management modules (CMM), and redundant high-speed, low-latency SDN switches. The 1Gb/2.5Gb Ethernet switches (MBM-GEM-001/003s/003i) and 10Gb Ethernet switch (MBM-XEM-001), based on Intel Ethernet switch FM5224 and FM6348, respectively, support enhanced features critical for today’s high performance switching environments: low latency, scalability, Priority Flow Control, and DCBX. These integrated switches simplify cable management and reduce cables up to 95% for Xeon processor-based solutions.

“Supermicro MicroBlade solutions deliver extreme high density, energy efficiency, optimized cooling and cost effectiveness by enabling VLP DDR4 16/32GB RDIMM without a price premium over existing memory technologies,” said Charles Liang, President and CEO of Supermicro. “Our advanced power saving, modular architecture leads the industry by dramatically increasing compute density to maximize performance per watt, per dollar, per square foot all while offering the best quality and ease of serviceability. With up to 112 full featured energy efficient compute nodes per 6U, MicroBlade delivers the most cost-effective, earth friendly server solution available for rapidly expanding data centers and cloud computing environments.”

For more information on Supermicro’s complete line of MicroBlade solutions, visit www.supermicro.com/MicroBlade.