Sequans Ships its Millionth WiMAX Chip

TAIPEI, WIMAX EXPO, booth A418, PARIS, France, and CUPERTINO, Calif. – June 2, 2009 — Sequans Communications, the world’s leading WiMAX chipmaker, announced today that it has shipped its one millionth chip. Sequans chips are present in virtually all global WiMAX deployments and powering the world’s most important WiMAX networks.

“This achievement represents a milestone for us and also for the WiMAX industry,” said Georges Karam, Sequans CEO. “In spite of the global recession, WiMAX is growing steadily and is now firmly established worldwide as a key technology delivering broadband service to many in both developed and emerging markets.”

Sequans was founded in 2003 and over the years since has brought nine WiMAX chips to market, including chips for base stations and subscriber stations for both fixed and Mobile WiMAX, and two RFICs. Sequans newest generation of chips, its 65nm series of baseband and triple band RF single die solutions, introduced early this year, features the highest level of integration yet achieved in the WiMAX industry, leading to dramatic improvements in performance, size, and cost.

“Sequans’ continuous investment in even more integrated, lower-power silicon chips allows it to reach significant shipment volumes and top notch power consumption and performance levels,” said Adlane Fellah, CEO, Maravedis, Inc., “Its recent launch of a single die 65nm Mobile WiMAX SoC will allow a new generation of devices that will help the overall industry reach the tipping point.”

Sequans chips are powering the leading WiMAX networks in India, Pakistan, Malaysia, Russia, Korea, and the USA.