CHICAGO, 4G WORLD, booth 423 — September 15, 2009 — Sequans Communications, the world’s leading WiMAX chipmaker, made public today its move into LTE and details of the LTE development program it launched earlier this year. Sequans has been preparing for this move as part of its long-term growth strategy and has been steadily adding resources and headcount to support it. Sequans intends to develop products for both the LTE and WiMAX markets in parallel.

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Tags: LTE,Sequans
文章分類: Communication
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CUPERTINO, Calif., and PARIS, France — June 9, 2009 – Sequans Communications, the world’s leading WiMAX chipmaker, has appointed Craig Miller to the position of vice president of marketing and business development, where he will work closely with the executive team on strategy development and will head Sequans’ marketing and business development programs. Miller spent 18 years at Intel in various marketing and business development roles and most recently was VP of product management and marketing at NextWave Wireless.

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Tags: Sequans,WiMAX
文章分類: Communication
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TAIPEI, WIMAX EXPO, booth A418, PARIS, France, and CUPERTINO, Calif. – June 2, 2009 — Sequans Communications, the world’s leading WiMAX chipmaker, announced today that it has shipped its one millionth chip. Sequans chips are present in virtually all global WiMAX deployments and powering the world’s most important WiMAX networks.

“This achievement represents a milestone for us and also for the WiMAX industry,” said Georges Karam, Sequans CEO. “In spite of the global recession, WiMAX is growing steadily and is now firmly established worldwide as a key technology delivering broadband service to many in both developed and emerging markets.”

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Tags: Sequans,WiMAX
文章分類: Communication, Component
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TAIPEI, WiMAX Expo, booth A418; Paris, France; and CUPERTINO, Calif. – June 2, 2009 — Sequans Communications, the world’s leading WiMAX chipmaker, has introduced the SQN1220, the second chip in its new generation series of 65nm Mobile WiMAX system-on-chip (SOC) solutions. The new chip features a high level of processing power as needed to support combination voice and data applications and targets manufacturers of voice/data CPE and gateways with a solution that eliminates the need for an external CPU or DSP. The first chip in Sequans’ 65nm series, the SQN1210, introduced three months ago, targets mobile applications. Both chips integrate baseband and triple band RF in a single 65nm die in an industry-first achievement that delivers unprecedented high performance, small size, and low cost.

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Tags: Sequans,WiMAX
文章分類: Communication, Component
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