Component IDT Working with Intel to Enable a Wire-free World Posted on 2014-09-29 by c4news SAN JOSE, Calif., Sept. 9, 201… Read More
Component Siemens Selects TouchNetix Capacitive Touchscreens for Latest Industrial Control Panels Posted on 2014-09-29 by c4news FAREHAM, UK, 29th September 20… Read More
Component 安森美半導體與 Transphorm合作提供領先業界能效的氮化鎵(GaN)之電源系統方案 Posted on 2014-09-29 by c4news 2014年9月29日 – 推動高能效創新的安森美半導體(ON… Read More
Component 德州儀器最新 100G 轉阻放大器推動光纖網路系統的高效能發展 Posted on 2014-09-29 by c4news (台北訊，2014年9月29) 德州儀器 (TI) 宣佈… Read More
Component Keysight UXM無線測試儀新增功能性測試特性，可大幅增進RF設計自信度 Posted on 2014-09-29 by c4news 是德科技（Keysight Technologies Inc… Read More
Component Mentor Graphics and TSMC Collaborate to Deliver IC Design and Signoff Infrastructure for 10nm Posted on 2014-09-29 by c4news ILSONVILLE, Oregon, Sept. 27, … Read More
Component IDT RapidIO互連技術支持Orange成功的社交媒體分析項目 Posted on 2014-09-29 by c4news 【2014年9月26日，台北訊】供應關鍵混合訊號半導體方案的… Read More
Component 全球首例FDD-TDD載波聚合採用Marvell 五模十頻LTE數據機晶片組 Posted on 2014-09-26 by c4news 【2014 年 9 月 22日，加州聖塔克拉拉訊】—全球整合… Read More
Component Highly Advanced, IO-Packed & Power Efficient USB 2.0 to SPI/I2C Bridge Chip Posted on 2014-09-26 by c4news FTDI Chip has long been regard… Read More
Component Honeywell先進材料改善行動裝置散熱以提升效能 Posted on 2014-09-26 by c4news 2014年9月25日– Honeywell (N… Read More