RAYSPAN Corporation 宣佈獲得超材料空中接口基礎專利

聖地牙哥2009年8月17日電 /美通社亞洲/ — 超材料空中接口解決方案的世界領先創新企業 RAYSPAN Corporation 欣然宣佈，該公司已經獲得一項基礎專利 ANTENNAS BASED ON METAMATERIAL STRUCTURES。該專利的權利要求涉足廣泛，包括各種超材料發明，這些發明讓 RAYSPAN 的突破性超小型天線及相關的空中接口部件和系統成為可能。RAYSPAN 的知識產權組合目前包括逾65個已授予和未決的美國國內和國際專利，範圍覆蓋世界最先進的超材料無線技術，從而為許可和保護該公司在全球蜂窩式手持設備和無線局域網 (LAN) 市場的超材料解決方案奠定了極其穩固的基礎。這一無與倫比的專利組合保護了 RAYSPAN 的所有基礎性自主結構、基於這些結構的天線和基本射頻部件、這些結構在重要頻率子系統和系統中的應用，以及完整的端到端通信網絡。

這些空中接口的突破創新採用了 RAYSPAN 的超材料技術，其中包括面向所有無線 LAN 和蜂窩式手持設備應用的超緊湊型寬頻和多頻天線、濾波器、耦合器、雙信號耦合器以及雙工器的實現。此外，這一獨特的超材料專利系列還支持高度集成的解決方案，將包括多輸入多輸出 (MIMO) 在內的小型天線陣列拓展為完整的射頻前端系統。

RAYSPAN 創立人兼首席技術官 Maha Achour 博士表示：「RAYSPAN 的創新在大規模成功部署當今先進的寬頻無線應用方面將一如既往地發揮重要作用。RAYSPAN 能夠利用其專有的超材料解決方案來解決射頻方面的重大挑戰，這無不彰顯了其所部署的技術的力量以及其在尺寸、性能和整合輕鬆度方面超過所有同類解決方案的能力。通過在整個射頻前端領域的不斷創新，RAYSPAN 在技術方面無疑將繼續稱霸業界。」

RAYSPAN 和超材料簡介：
RAYSPAN Corporation 旨在研發、銷售和許可全球領先的專有超材料無線空中接口解決方案組合。超材料是一種合成材料，用於產生所需要的但在自然媒介中不存在的電磁傳播特性。它們讓空中接口小型化、性能以及整合方面的創新突破變為可能，同時還降低了成本，并簡化了製造流程。

無線空中接口是每個無線設備必不可少的一部分，它包括天線和射頻前端部件：濾波器、開關、耦合器、雙信號耦合器、雙工器和功率放大器。如今的空中接口也出現了無線行業一些最具挑戰性的系統整合問題。隨著新標準不斷提倡要像 MIMO 系統那樣使用多個射頻、複合調製電路以及多模式和通道，對配有接口的部件的尺寸和空間要求讓在實現緊湊型移動終端的同時還保持足夠的系統性能變得難上加難。

RAYSPAN 的超材料空中接口解決方案果斷地解決了這些問題。它們憑藉優越的通信速度、範圍和移動性，以較低的成本支持超緊湊型、多頻帶、多模式和/或 MIMO WLAN 設備和蜂窩式手持設備。這些解決方案基本上滿足了 WLAN 和手持設備市場的所有細分領域，并在 RAYSPAN 的許可模式下，還能以低價成本得到快速部署。

RAYSPAN Corporation Announces Grant of Fundamental Metamaterial Air Interface Patent
SAN DIEGO, Aug. 17 /PRNewswire-Asia/ — RAYSPAN Corporation, the world’s leading innovator of metamaterial air interface solutions, is proud to announce it has been granted a fundamental patent, ANTENNAS BASED ON METAMATERIAL STRUCTURES. The sweeping claims of this patent encompass a broad range of metamaterial inventions that make possible RAYSPAN’s breakthrough ultra-miniature antennas and related air interface components and systems. With an intellectual property portfolio that now includes over sixty-five awarded and pending domestic and international patents covering the world’s most advanced metamaterial wireless technology, RAYSPAN has established an extremely strong foundation for licensing and protecting its metamaterial solutions in the global cellular handset and wireless LAN markets. This unmatched patent portfolio protects the full span of RAYSPAN’s fundamental enabling structures, antennas and essential radio frequency (RF) components based on those structures, use of those structures in key RF subsystems and systems, and complete end-to-end communication networks.

The air interface breakthroughs enabled by RAYSPAN’s metamaterial technology include ultra-compact implementations for broadband and multi-band antennas, filters, couplers, diplexers, and duplexers for all wireless LAN and cellular handset applications. In addition, the unique properties of metamaterials enable highly integrated solutions, extending from miniaturized antenna arrays, including MIMO, to complete RF front-end systems.

“RAYSPAN’s innovations continue to be key in successfully implementing today’s advanced broadband wireless applications on a large scale,” said Dr. Maha Achour, Founder and Chief Technical Officer of RAYSPAN, Inc. “RAYSPAN’s ability to solve key RF challenges using its proprietary metamaterial solutions is testimony to the power of the technology it has developed and its ability to surpass all competing solutions in size, performance, and ease of integration. Without any doubt, RAYSPAN will remain a technology leader through its continuous innovations across the whole RF front-end landscape.”

About RAYSPAN and Metamaterials:

The mission of RAYSPAN Corporation is to research, develop, market and license the world’s leading portfolio of proprietary metamaterial wireless air interface solutions. Metamaterials are composite materials engineered to produce desired electromagnetic propagation behavior not found in natural media. They make possible breakthrough advances in air interface miniaturization, performance and integration while simultaneously reducing costs and simplifying manufacturing.

The wireless air interface is an essential part of every wireless device and is comprised of the antenna(s) and RF front-end components: filters, switches, couplers, diplexers, duplexers and power amplifiers. Today’s air interface presents some of the most challenging system integration problems facing the wireless industry. As new standards call for utilizing multiple radio bands, complex modulation schemes and multiple modes and channels, as in MIMO systems, the size and spacing requirements of the components that comprise the interface make it virtually impossible to achieve compact mobile terminal size while maintaining adequate system performance.

RAYSPAN’s metamaterial air interface solutions decisively solve these problems. They enable ultra-compact, multi-band, multi-mode and/or MIMO WLAN devices and cellular handsets with superior communication speed, range and mobility at reduced costs. These solutions address virtually all segments of the WLAN and handset markets, and they can be implemented quickly and inexpensively under RAYSPAN’s licensing model.