Component Diodes全新整合式高壓穩壓器電晶體有效提升功率密度 Posted on 2013-07-19 by c4news 台灣 — 7月18日—Diodes公司 (Diodes In… Read More
Component Micron Technology Announces Director Appointment Posted on 2013-07-19 by c4news BOISE, Idaho, July 17, 2013 (G… Read More
Component Flexstar Announces the First Testing Solution for the Next Generation in Storage Devices, the Non-Volatile Memory Express (NVMe) 1.0C PCIe SSD Posted on 2013-07-19 by c4news SAN JOSE, Calif., July 17, 201… Read More
Component Littelfuse暫態抑制二極體陣列抗靜電放電和雷擊的性能比同類產品強40% Posted on 2013-07-19 by c4news 台灣，台北，2013年7月17日訊——Littelfuse公… Read More
Component Micron Unveils 16-Nanometer Flash Memory Technology Posted on 2013-07-19 by c4news BOISE, Idaho, July 16, 2013 (G… Read More
Component Isola to Expand Its Quick-turn Manufacturing Capabilities in Suzhou, China Posted on 2013-07-19 by c4news CHANDLER, Ariz., July 16, 2013… Read More
Component Silicon Labs運用Wonder Gecko MCU開發套件 加速DSP智慧感測器系統設計 Posted on 2013-07-18 by c4news 台灣，台北 – 2013年7月15日 ̵… Read More
Component TI 最新低功耗 RF 收發器為次1 GHz 無線連結 Posted on 2013-07-17 by c4news (台北訊，2013 年 7 月 15 日) 德州儀器 (… Read More
Component Wolfson高傳真音訊中樞獲夏普新款智慧型手機和平板採用 Posted on 2013-07-17 by c4news 【2013年7月15日．台北訊】專為消費性電子市場設計開發混… Read More
Component 瑞昱半導體推出低功耗USB Ethernet控制晶片解決方案 Posted on 2013-07-17 by c4news 全球頂尖的網路與多媒體晶片大廠瑞昱半導體，今天宣布瑞昱的US… Read More